Staff II Design Engineer - High-Speed Board Design


Broadcom Corporation (NASDAQ: BRCM), a FORTUNE 500® company, is a global leader and innovator in semiconductor solutions for wired and wireless communications. Broadcom® products seamlessly deliver voice, video, data and multimedia connectivity in the home, office and mobile environments. With the industry’s broadest portfolio of state-of-the-art system-on-a-chip and embedded software solutions, Broadcom is changing the world by Connecting everything®.



Job Req ID: 549387 



Job Posting Title: Staff II Design Engineer – High-Speed Board Design



City: Santa Clara



State: California



Country: USA



Alternate Location: N/A



Percent of Travel Required: 0%



Job Function: Engineering



Discipline: ENG-Hardware-IC Design



Engineer, Staff II – IC Design, Santa Clara






Responsibilities include:






– Design and develop high-speed boards for ARM based server class processors.






– Hands-on activities involve design of logic circuits, parts selection, schematics capture, support to layout work, fab & assembly of boards, bring-up & testing of boards and support to manufacturing.






– Execute signal integrity simulations and power integrity simulations of the high-speed interfaces.






– Write Verilog HDL code to implement logic circuits in CPLD.






– Collaborate with software team, operations team, characterization team, applications team, chip design team, thermal engineering team and mechanical engineering team.






– Review customer designs and provide support to the chip customers.






Job Requirements: 






– BS or equivalent degree in Electronics or Electrical Engineering with 6-9 years of prior hands-on work experience on high-speed board designs.






– Knowledge of Verilog HDL.






– Experience of board designs involving high-speed interfaces like DDR3/DDR4 memory, PCI-E, networking interfaces like SGMII, XAUI, XLAUI, XFI, CAUI etc., USB, SATA.






– Experience of board designs involving memory devices like NAND, NOR, eMMC, SPI, SD cards.






– Knowledge of PCB layout concepts, stack-up, DFx, EMI/EMC, safety stds.






– Working experience of using the EDA tools like Cadence ORCAD CIS, Allegro PCB, Allegro PCB SI, Sigrity SI.






– Experience of running the pre-layout and post-layout signal integrity simulations and power-integrity simulations and defining layout constraints.






– Experience of using the test equipments like oscilloscopes, logic analyzers, protocol analyzers and Ethernet testers.






– Should be well organized, detail oriented and methodical in approach.






– Should possess strong verbal and written communication skills.






– Should be a self-driven team player with commitment and passion to own and contribute to project goals.



Broadcom is an equal opportunity employer (Minorities/Females/Disabled/Veterans)





Nearest Major Market: San Jose


Nearest Secondary Market: Palo Alto


Job Segment:
Semiconductor, Thermal Engineering, Electronics Engineer, Manufacturing Engineer, Engineer, Science, Engineering


Source link




EmoticonEmoticon