Broadcom Corporation (NASDAQ: BRCM), a FORTUNE 500® company, is a global leader and innovator in semiconductor solutions for wired and wireless communications. Broadcom® products seamlessly deliver voice, video, data and multimedia connectivity in the home, office and mobile environments. With the industry’s broadest portfolio of state-of-the-art system-on-a-chip and embedded software solutions, Broadcom is changing the world by Connecting everything®.
Job Req ID: 548361
Job Posting Title: Principal – Reliability Engineer
City: Irvine
State: California
Country: USA
Alternate Location: N/A
Percent of Travel Required: 0% – 25%
Job Function: Engineering
Discipline: ENG-Other-Reliability
Job Descriptions:
– The candidate will be Broadcom’s reliability engineer to support new ASIC product qualification for key customers
– Participate with marketing, customer quality engineer and foundry engineer in routine product status review meeting with key customers.
– Respond to customer requests related to reliability data collection or reliability analysis for wafer process or a product.
– Review product HTOL schematics and setup with product engineer to ensure that it meets special HTOL requirements.
– Review process reliability qualification or early reliability assessment data. Work with foundry engineer to drive the foundry to complete process qualification in time to meet product launch schedule.
– In case of yield or reliability issue found at the process development stage, co-work with foundry engineer and foundry partner to identify wafer process improvement DOE for improving yield and reliability.
– Monitor the progress of process reliability monitor and product reliability monitor.
– Work with product engineer, chip lead in debugging any product issue during early reliability assessment or qualification.
Job Requirements:
– Typically Requires an MS with 9+ years of semiconductor industry experience or a Ph.D. with 6+ years of semiconductor industry experience.
– Ph.D. in Electrical Engineering or Physics, Chemistry preferred
– Experiences of 130nm to 40nm CMOS process module development and/or process integration are required.
– Knowledge of wafer FEOL & BEOL process/device reliability of 28nm~ 130nm CMOS processes are required.
– Experiences of 28nm, 20nm, 16FF process module development and/or process integration are preferred.
– Experiences in high voltage process are preferred.
– Experiences in non-volatile memory process are preferred.
– Experiences of burn in board design, burn in schematics and setup are preferred.
– Experiences in ESD, latchup testing are preferred.
– Experiences of yield debug or yield enhancement are preferred
– Excellent communication skills for working with customers are required
– Experiences in interfacing with chip lead in circuit review and product failure debug are preferred.
Broadcom is an equal opportunity employer (Minorities/Females/Disabled/Veterans)
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