Broadcom Corporation (NASDAQ: BRCM), a FORTUNE 500® company, is a global leader and innovator in semiconductor solutions for wired and wireless communications. Broadcom® products seamlessly deliver voice, video, data and multimedia connectivity in the home, office and mobile environments. With the industry’s broadest portfolio of state-of-the-art system-on-a-chip and embedded software solutions, Broadcom is changing the world by Connecting everything®.
Job Req ID: 547101
Job Posting Title: Senior to Principal level IC Package Design/Assembly Engtineer
City: San Jose
State: California
Country: USA
Alternate Location: N/A; US – California, Southern – Irvine
Percent of Travel Required: 0% – 25%
Job Function: Engineering
Discipline: ENG-Other-Packaging
- Work with marketing and IC design team to select the optimized package solution
- Work with IC design, system design, package SI/PI & thermal engineering teams to design custom packages
- Design redistribution layers and work with design team to optimize die floorplan & bump patterns
- Manage packaging activity from concept through development, qualification and high volume production.
- Define assembly BOM, process, troubleshoot and provide sustaining support on packaging issues
- Create package design documentation and assembly instructions
- Work close with QA and customers to resolve quality issues
- Interface with packaging assembly and substrate suppliers for new product bring-up, qualification and production ramp
- BS/MS in Electrical/Mechanical Engineering preferred. Typically requires a BS and 9-12 years of experience in IC packaging and assembly or an MS and 6-9 years of experience in IC packaging and assembly or a PhD and 3-6 years of experience in IC packaging and assembly
- Strong authority on Cadence APD for custom substrate/RDL designs
- Hands-on expertise of assembly processes for flipchip, wirebond FBGA & QFN, & wafer level packages
- Knowledge of substrate manufacturing is plus
- Knowledge of failure analysis techniques
- Conceptual knowledge of package cost structure
- Good project management, communication and leadership skills
Broadcom is an equal opportunity employer (Minorities/Females/Disabled/Veterans)
Job Segment:
Package Design, Semiconductor, Assembly, Engineer, Electrical, Manufacturing, Science, Engineering
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